From 1/32 Micro-Brick to Half Brick — the same high-efficiency platform in progressively larger form factors. Patented topologies delivering industry-leading power density.
Ultra-compact Micro-Brick with patented Buck-reset Forward topology. Exceptional power density — no heatsink required. Ideal for space-constrained board designs.
1/16 Brick form factor with broad input range. High-efficiency synchronous rectification with coupled-inductor SR topology. Scalable power for diverse telecom and data applications.
Quarter brick for 300W/60A. Dense power for demanding board designs. High current output with superior thermal performance.
Up to 800W scalable half brick. Parallel-stackable — each additional unit doubles output power. Ultra-high reliability designed for mission-critical telecom infrastructure.
Tell us your input voltage, output requirement, and board space. We'll identify the right Ultra Series module within one business day.